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INTEGRATED CIRCUITS
DATA SHEET
TEA1094; TEA1094A Hands free IC
Product specification Supersedes data of 1996 Mar 11 File under Integrated Circuits, IC03 1996 Jul 15
Philips Semiconductors
Product specification
Hands free IC
FEATURES * Low power consumption * Power-down function (TEA1094A only) * Microphone channel with: - externally adjustable gain - microphone mute function. * Loudspeaker channel with: - externally adjustable gain - dynamic limiter to prevent distortion - rail-to-rail output stage for single-ended load drive - logarithmic volume control via linear potentiometer - loudspeaker mute function. * Duplex controller consisting of: - signal envelope and noise envelope monitors for both channels with: externally adjustable sensitivity externally adjustable signal envelope time constant externally adjustable noise envelope time constant - decision logic with: externally adjustable switch-over timing externally adjustable idle mode timing externally adjustable dial tone detector in receive channel - voice switch control with: adjustable switching range constant sum of gain during switching constant sum of gain at different volume settings. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TEA1094 TEA1094A TEA1094T TEA1094AT TEA1094AM DIP28 DIP24 SO28 SO24 SSOP24 DESCRIPTION plastic dual in-line package; 28 leads (600 mil) plastic dual in-line package; 24 leads (600 mil) APPLICATIONS
TEA1094; TEA1094A
* Mains, battery or line-powered telephone sets with hands-free/listening-in functions * Cordless telephones * Answering machines * Fax machines. GENERAL DESCRIPTION The TEA1094 and TEA1094A are bipolar circuits intended for use in mains, battery or line-powered telephone sets, cordless telephones, answering machines and Fax machines. In conjunction with a member of the TEA106X, TEA111X families of transmission circuits, the devices offer a hands-free function. They incorporate a microphone amplifier, a loudspeaker amplifier and a duplex controller with signal and noise monitors on both channels.
VERSION SOT117-1 SOT101-1 SOT136-1 SOT137-1 SOT340-1
plastic small outline package; 28 leads; body width 7.5 mm plastic small outline package; 24 leads; body width 7.5 mm plastic shrink small outline package; 24 leads; body width 5.3 mm
1996 Jul 15
2
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
QUICK REFERENCE DATA VBB = 5 V; VGND = 0 V; f = 1 kHz; Tamb = 25 C; MUTET = LOW; PD = LOW (TEA1094A only); RL = 50 ; RVOL = 0 ; measured in test circuit of Fig.12; unless otherwise specified. SYMBOL VBB IBB Gvtx Gvtxr Gvrx PARAMETER supply voltage current consumption from pin VBB voltage gain from pin MIC to pin MOUT in transmit mode voltage gain adjustment with RGAT voltage gain in receive mode; the difference between RIN1 and RIN2 to LSP voltage gain adjustment with RGAR output voltage (peak-to-peak value) VRIN = 150 mV (RMS); RGAR = 374 k; RL = 33 ; VBB = 9.0 V; note 1 VRIN = 20 mV (RMS); RGAR = 66.5 k; RL = 50 VMIC = 1 mV (RMS); RGAT = 30.1 k CONDITIONS - 13 -15.5 16 MIN. 3.3 - 3.1 15.5 - 18.5 TYP. MAX. 12.0 4.4 18 +15.5 21 UNIT V mA dB dB dB
Gvrxr VO(p-p)
-18.5 -
- 7.5
+14.5 -
dB V
SWRA SWRA Tamb Note
switching range switching range adjustment with RSWR referenced to RSWR = 365 k operating ambient temperature
- -40 -25
40 - -
- +12 +75
dB dB C
1. Corresponds to 200 mW output power.
1996 Jul 15
3
Philips Semiconductors
Product specification
Hands free IC
BLOCK DIAGRAM
handbook, full pagewidth
TEA1094; TEA1094A
10 (7) (13)
VBB PD(1)
TEA1094 TEA1094A
MICROPHONE CHANNEL
GND
8 (6)
VBB
19 (15) MUTET CMIC 22 (18) MIC
GAT
21 (17) 20 (16) 18 (14)
RGAT
V
I
I
V
MOUT MICGND
to TEA106x
RMIC
IDT RTSEN CTSEN BUFF 28 (24) TSEN LOG
16 (12)
RIDT
DUPLEX CONTROLLER
Vref 14 (11) CSWT
SWT
27 (23) TENV CTENV 26 (22) CTNOI CRNOI BUFF
13 mV
ATTENUATOR TNOI STAB 13 (10) RSTAB
23 (19) RNOI VOICE SWITCH
LOGIC BUFF 24 (20) RENV CRENV 13 mV BUFF RRSEN CRSEN 25 (21) RSEN LOG Vdt
SWR
12 (9)
RSWR
RGAR
5 (4) 6 (5)
GAR VBB LSP V I I V
2 RIN1 RIN2
2 (2) 3 (3) 11 (8) RVOL from TEA106x
CLSP 1 (1) CDLC DLC/MUTER DYNAMIC LIMITER
VOLUME VOL CONTROL
LOUDSPEAKER CHANNEL
MGE436
The pin numbers given in parenthesis are for the TEA1094A. (1) TEA1094A only.
Fig.1 Block diagram.
1996 Jul 15
4
Philips Semiconductors
Product specification
Hands free IC
PINNING PINS SYMBOL TEA1094 DLC/MUTER RIN1 RIN2 n.c. GAR LSP n.c. GND n.c. VBB VOL SWR STAB SWT n.c. IDT PD n.c. MICGND MUTET MOUT GAT MIC RNOI RENV RSEN TNOI TENV TSEN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 - 17 18 19 20 21 22 23 24 25 26 27 28 TEA1094A 1 2 3 - 4 5 - 6 - 7 8 9 10 11 - 12 13 - 14 15 16 17 18 19 20 21 22 23 24
TEA1094; TEA1094A
DESCRIPTION dynamic limiter timing adjustment; receiver channel mute input receiver amplifier input 1 receiver amplifier input 2 not connected receiver gain adjustment loudspeaker amplifier output not connected ground reference not connected supply voltage receiver volume adjustment switching range adjustment reference current adjustment switch-over timing adjustment not connected idle mode timing adjustment power-down input not connected ground reference for the microphone amplifier transmit channel mute input microphone amplifier output microphone gain adjustment microphone input receive noise envelope timing adjustment receive signal envelope timing adjustment receive signal envelope sensitivity adjustment transmit noise envelope timing adjustment transmit signal envelope timing adjustment transmit signal envelope sensitivity adjustment
1996 Jul 15
5
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
handbook, halfpage
handbook, halfpage
DLC/MUTER RIN1 RIN2 n.c. GAR LSP n.c. GND n.c.
1 2 3 4 5 6 7
28 TSEN 27 TENV 26 TNOI 25 RSEN 24 RENV 23 RNOI 22 MIC
DLC/MUTER RIN1 RIN2 GAR LSP GND VBB VOL SWR
1 2 3 4 5 6
24 TSEN 23 TENV 22 TNOI 21 RSEN 20 RENV 19 RNOI
TEA1094A
7 8 9 18 MIC 17 GAT 16 MOUT 15 14 13
MGE435
TEA1094
8 9 21 GAT 20 MOUT 19 MUTET 18 MICGND 17 n.c. 16 IDT 15 n.c.
MGE434
VBB 10 VOL 11 SWR 12 STAB 13 SWT 14
STAB 10 SWT 11 IDT 12
MUTET MICGND PD
Fig.2 Pin configuration (TEA1094).
Fig.3 Pin configuration (TEA1094A).
FUNCTIONAL DESCRIPTION General The values given in the functional description are typical values unless otherwise specified. A principle diagram of the TEA106X is shown on the left side of Fig.4. The TEA106X is a transmission circuit of the TEA1060 family intended for hand-set operation. It incorporates a receiving amplifier for the earpiece, a transmit amplifier for the microphone and a hybrid. For more details on the TEA1060 family, please refer to "data Handbook IC03". The right side of Fig.4 shows a principle diagram of the TEA1094 and TEA1094A, hands-free add-on circuits with a microphone amplifier, a loudspeaker amplifier and a duplex controller. As can be seen from Fig.4, a loop is formed via the sidetone network in the transmission circuit and the acoustic coupling between loudspeaker and microphone of the hands-free circuit. When this loop gain is greater than 1, howling is introduced. In a full duplex application, this would be the case. The loop-gain has to be much lower than 1 and therefore 1996 Jul 15 6
has to be decreased to avoid howling. This is achieved by the duplex controller. The duplex controller of the TEA1094 and TEA1094A detects which channel has the `largest' signal and then controls the gain of the microphone amplifier and the loudspeaker amplifier so that the sum of the gains remains constant. As a result, the circuit can be in three stable modes: 1. Transmit mode (Tx mode). The gain of the microphone amplifier is at its maximum and the gain of the loudspeaker amplifier is at its minimum. 2. Receive mode (Rx mode). The gain of the loudspeaker amplifier is at its maximum and the gain of the microphone amplifier is at its minimum. 3. Idle mode. The gain of the amplifiers is halfway between their maximum and minimum value. The difference between the maximum gain and minimum gain is called the switching range.
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
handbook, full pagewidth
acoustic coupling
telephone line
HYBRID
DUPLEX CONTROL
sidetone TEA1094 TEA1094A
TEA106x
MGE438
Fig.4 Hands-free telephone set principles.
Supply: pins VBB, GND and PD The TEA1094 and TEA1094A must be supplied with an external stabilized voltage source between pins VBB and GND. In the idle mode, without any signal, the internal supply current is 3.1 mA at VBB = 5 V. To reduce the current consumption during pulse dialling or register recall (flash), the TEA1094A is provided with a power-down (PD) input. When the voltage on PD is HIGH the current consumption from VBB is 180 A. Microphone channel: pins MIC, GAT, MOUT, MICGND and MUTET (see Fig.5) The TEA1094 and TEA1094A have an asymmetrical microphone input MIC with an input resistance of 20 k. The gain of the input stage varies according to the mode of the TEA1094 and TEA1094A. In the transmit mode, the gain is at its maximum; in the receive mode, it is at its minimum and in the idle mode, it is halfway between maximum and minimum.
Switch-over from one mode to the other is smooth and click-free. The output capability at pin MOUT is 20 A (RMS). In the transmit mode, the overall gain of the microphone amplifier (from pins MIC to MOUT) can be adjusted from 0 dB up to 31 dB to suit specific application requirements. The gain is proportional to the value of RGAT and equals 15.5 dB with RGAT = 30.1 k. A capacitor must be connected in parallel with RGAT to ensure stability of the microphone amplifier. Together with RGAT, it also provides a first-order low-pass filter. By applying a HIGH level on pin MUTET, the microphone amplifier is muted and the TEA1094 and TEA1094A are automatically forced into the receive mode.
1996 Jul 15
7
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
handbook, full pagewidth
19 MUTET VBB (15)
GAT 21 (17)
RGAT CGAT
CMIC
22 MIC
(18) RMIC to envelope detector
V
I
I
V
MOUT 20 (16)
to TEA106X
from voice switch
to logic
MICGND
18 (14)
MGD343
The pin numbers given in parenthesis refer to the TEA1094A.
Fig.5 Microphone channel.
Loudspeaker channel
handbook, full pagewidth
RGAR
5 (4) GAR VBB V I
to logic
to/from voice switch
to envelope detector 2 2 RIN1 (2) 3 RIN2 (3) 11 VOL (8) RVOL from TEA106x
CGAR CLSP
6 (5) LSP
I
V
1 (1) DLC/MUTER CDLC
DYNAMIC LIMITER
VOLUME CONTROL
MGE437
The pin numbers given in parenthesis refer to the TEA1094A.
Fig.6 Loudspeaker channel.
1996 Jul 15
8
Philips Semiconductors
Product specification
Hands free IC
LOUDSPEAKER AMPLIFIER: PINS RIN1, RIN2, GAR AND LSP The TEA1094 and TEA1094A have symmetrical inputs for the loudspeaker amplifier with an input resistance of 40 k between RIN1 and RIN2 (2 x 20 k). The input stage can accommodate signals up to 390 mV (RMS) at room temperature for 2% of total harmonic distortion (THD). The gain of the input stage varies according to the mode of the TEA1094 and TEA1094A. In the receive mode, the gain is at its maximum; in the transmit mode, it is at its minimum and in the idle mode, it is halfway between maximum and minimum. Switch-over from one mode to the other is smooth and click-free. The rail-to-rail output stage is designed to power a loudspeaker connected as a single-ended load (between LSP and GND). In the receive mode, the overall gain of the loudspeaker amplifier can be adjusted from 0 dB up to 33 dB to suit specific application requirements. The gain from RIN1 and RIN2 to LSP is proportional to the value of RGAR and equals 18.5 dB with RGAR = 66.5 k. A capacitor connected in parallel with RGAR can be used to provide a first-order low-pass filter. VOLUME CONTROL: PIN VOL The loudspeaker amplifier gain can be adjusted with the potentiometer RVOL. A linear potentiometer can be used to obtain logarithmic control of the gain at the loudspeaker amplifier. Each 950 increase of RVOL results in a gain loss of 3 dB. The maximum gain reduction with the volume control is internally limited to the switching range. DYNAMIC LIMITER: PIN DLC/MUTER The dynamic limiter of the TEA1094 and TEA1094A prevents clipping of the loudspeaker output stage and protects the operation of the circuit when the supply voltage at VBB falls below 2.9 V. Hard clipping of the loudspeaker output stage is prevented by rapidly reducing the gain when the output stage starts to saturate. The time in which gain reduction is effected (clipping attack time) is approximately a few milliseconds. The circuit stays in the reduced gain mode until the peaks of the loudspeaker signals no longer cause saturation. The gain of the loudspeaker amplifier then returns to its normal value within the clipping release time (typically 250 ms). Both attack and release times are proportional to the value of the capacitor CDLC. The total harmonic distortion of the loudspeaker output stage, in reduced gain mode, stays below 5% up to 10 dB (minimum) of input voltage overdrive [providing VRIN is below 390 mV (RMS)].
TEA1094; TEA1094A
When the supply voltage drops below an internal threshold voltage of 2.9 V, the gain of the loudspeaker amplifier is rapidly reduced (approximately 1 ms). When the supply voltage exceeds 2.9 V, the gain of the loudspeaker amplifier is increased again. By forcing a level lower than 0.2 V on pin DLC/MUTER, the loudspeaker amplifier is muted and the TEA1094 (TEA1094A) is automatically forced into the transmit mode. Duplex controller SIGNAL AND NOISE ENVELOPE DETECTORS: PINS TSEN, TENV, TNOI, RSEN, RENV AND RNOI The signal envelopes are used to monitor the signal level strength in both channels. The noise envelopes are used to monitor background noise in both channels. The signal and noise envelopes provide inputs for the decision logic. The signal and noise envelope detectors are shown in Fig.7. For the transmit channel, the input signal at MIC is 40 dB amplified to TSEN. For the receive channel, the differential signal between RIN1 and RIN2 is 0 dB amplified to RSEN. The signals from TSEN and RSEN are logarithmically compressed and buffered to TENV and RENV respectively. The sensitivity of the envelope detectors is set with RTSEN and RRSEN. The capacitors connected in series with the two resistors block any DC component and form a first-order high-pass filter. In the basic application, see Fig.13, it is assumed that VMIC = 1 mV (RMS) and VRIN = 100 mV (RMS) nominal and both RTSEN and RRSEN have a value of 10 k. With the value of CTSEN and CRSEN at 100 nF, the cut-off frequency is at 160 Hz. The buffer amplifiers leading the compressed signals to TENV and RENV have a maximum source current of 120 A and a maximum sink current of 1 A. Together with the capacitor CTENV and CRENV, the timing of the signal envelope monitors can be set. In the basic application, the value of both capacitors is 470 nF. Because of the logarithmic compression, each 6 dB signal increase means 18 mV increase of the voltage on the envelopes TENV or RENV at room temperature. Thus, timings can be expressed in dB/ms. At room temperature, the 120 A sourced current corresponds to a maximum rise-slope of the signal envelope of 85 dB/ms. This is sufficient to track normal speech signals. The 1 A current sunk by TENV or RENV corresponds to a maximum fall-slope of 0.7 dB/ms. This is sufficient for a smooth envelope and also eliminates the effect of echoes on switching behaviour.
1996 Jul 15
9
Philips Semiconductors
Product specification
Hands free IC
To determine the noise level, the signals on TENV and RENV are buffered to TNOI and RNOI. These buffers have a maximum source current of 1 A and a maximum sink current of 120 A. Together with the capacitors CTNOI and CRNOI, the timing can be set. In the basic application of Fig.13 the value of both capacitors is 4.7 F. At room temperature, the 1 A sourced current corresponds to a maximum rise-slope of the noise envelope of approximately 0.07 dB/ms.
TEA1094; TEA1094A
This is small enough to track background noise and not to be influenced by speech bursts. The 120 A current that is sunk corresponds to a maximum fall-slope of approximately 8.5 dB/ms. However, during the decrease of the signal envelope, the noise envelope tracks the signal envelope so it will never fall faster than approximately 0.7 dB/ms. The behaviour of the signal envelope and noise envelope monitors is illustrated in Fig.8.
handbook, full pagewidth
DUPLEX CONTROLLER to logic LOG from microphone amplifier from loudspeaker amplifier LOG to logic
TSEN 28 (24) RTSEN CTSEN
TENV 27 (23)
TNOI 26 (22)
RSEN 25 (21) RRSEN
RENV 24 (20)
RNOI 23 (19)
CTENV
CTNOI
CRSEN
CRENV
CRNOI
The pin numbers given in parenthesis refer to the TEA1094A.
MGD223
Fig.7 Signal and noise envelope detectors.
handbook, full pagewidth
4 mV (RMS) 1 mV (RMS)
MBG354
INPUT SIGNAL
SIGNAL ENVELOPE A A: 85 dB/ms B: 0.7 dB/ms 36 mV B A B
NOISE ENVELOPE C B: 0.7 dB/ms C: 0.07 dB/ms 36 mV B C B
time
Fig.8 Signal and noise envelope waveforms.
1996 Jul 15
10
Philips Semiconductors
Product specification
Hands free IC
DECISION LOGIC: PINS IDT AND SWT
TEA1094; TEA1094A
handbook, full pagewidth
16 IDT (12) DUPLEX CONTROLLER Vref 27 (23) TENV TNOI 26 (22) 13 mV
ATTENUATOR
LOGIC(1)
RIDT 14 SWT (11)
CSWT X X 1 13 mV X 0 X 0 1 0 0 X 0 0 X 1 X 1 0 0 1 X X - 10 A + 10 A + 10 A
24 (20) RENV RNOI 23 (19)
19 (15) MUTET
Vdt
from dynamic limiter
MGD224
The pin numbers given in parenthesis refer to the TEA1094A. (1) When MUTET = HIGH, +10 A is forced. When DLC/MUTER < 0.2 V, -10 A is forced.
Fig.9 Decision logic.
The TEA1094 and TEA1094A select their modes of operation (transmit, receive or idle mode) by comparing the signal and the noise envelopes of both channels. This is executed by the decision logic. The resulting voltage on pin SWT is the input for the voice-switch. To facilitate the distinction between signal and noise, the signal is considered as speech when its envelope is more than 4.3 dB above the noise envelope. At room temperature, this is equal to a voltage difference VENV - VNOI = 13 mV. This so called speech/noise threshold is implemented in both channels. The signal on MIC contains both speech and the signal coming from the loudspeaker (acoustic coupling). When receiving, the contribution from the loudspeaker overrules the speech. 1996 Jul 15 11
As a result, the signal envelope on TENV is formed mainly by the loudspeaker signal. To correct this, an attenuator is connected between TENV and the TENV/RENV comparator. Its attenuation equals that applied to the microphone amplifier. When a dial tone is present on the line, without monitoring, the tone would be recognized as noise because it is a signal with a constant amplitude. This would cause the TEA1094 (TEA1094A) to go into the idle mode and the user of the set would hear the dial tone fade away. To prevent this, a dial tone detector is incorporated which, in standard applications, does not consider input signals between RIN1 and RIN2 as noise when they have a level greater than 127 mV (RMS). This level is proportional to RRSEN.
Philips Semiconductors
Product specification
Hands free IC
As can be seen from Fig.9, the output of the decision logic is a current source. The logic table gives the relationship between the inputs and the value of the current source. It can charge or discharge the capacitor CSWT with a current of 10 A (switch-over). If the current is zero, the voltage on SWT becomes equal to the voltage on IDT via the high-ohmic resistor RIDT (idling). The resulting voltage difference between SWT and IDT determines the mode of the TEA1094 (TEA1094A) and can vary between -400 and +400 mV (see Table 1). Table 1 Modes of TEA1094; TEA1094A VSWT - VIDT (mV) <-180 0 >180 idle mode receive mode MODE transmit mode
TEA1094; TEA1094A
The difference between maximum and minimum is the so called switching range. This range is determined by the ratio of RSWR and RSTAB and is adjustable between 0 and 52 dB. RSTAB should be 3.65 k and sets an internally used reference current. In the basic application diagram given in Fig.13, RSWR is 365 k which results in a switching range of 40 dB. The switch-over behaviour is illustrated in Fig.11. In the receive mode, the gain of the loudspeaker amplifier can be reduced using the volume control. Since the voice-switch keeps the sum of the gains constant, the gain of the microphone amplifier is increased at the same time (see dashed curves in Fig.11). In the transmit mode, however, the volume control has no influence on the gain of the microphone amplifier or the gain of the loudspeaker amplifier. Consequently, the switching range is reduced when the volume is reduced. At maximum reduction of volume, the switching range becomes 0 dB.
The switch-over timing can be set with CSWT, the idle mode timing with CSWT and RIDT. In the basic application given in Fig.13, CSWT is 220 nF and RIDT is 2.2 M. This enables a switch-over time from transmit to receive mode or vice-versa of approximately 13 ms (580 mV swing on SWT). The switch-over time from idle mode to transmit mode or receive mode is approximately 4 ms (180 mV swing on SWT). The switch-over time, from receive mode or transmit mode to idle mode, is equal to 4 x RIDTCSWT and is approximately 2 seconds (idle mode time). The inputs MUTET and DLC/MUTER overrule the decision logic. When MUTET goes HIGH, the capacitor CSWT is charged with 10 A thus resulting in the receive mode. When the voltage on pin DLC/MUTER goes lower than 0.2 V, the capacitor CSWT is discharged with 10 A thus resulting in the transmit mode. VOICE-SWITCH: PINS STAB AND SWR A diagram of the voice-switch is illustrated in Fig.10. With the voltage on SWT, the TEA1094 (TEA1094A) voice-switch regulates the gains of the transmit and the receive channel so that the sum of both is kept constant. In the transmit mode, the gain of the microphone amplifier is at its maximum and the gain of the loudspeaker amplifier is at its minimum. In the receive mode, the opposite applies. In the idle mode, both microphone and loudspeaker amplifier gains are halfway.
from volume control
DUPLEX CONTROLLER to microphone amplifier
from SWT
Gvtx + Gvrx = C(1) VOICE SWITCH
13 R STAB STAB (10) SWR 12 (9) RSWR
to loudspeaker amplifier
MGD225
The pin numbers given in parenthesis refer to the TEA1094A. (1) C = constant.
Fig.10 Voice switch.
1996 Jul 15
12
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
handbook, halfpage
idle mode
MBG351
Tx mode Gvtx, Gvrx (10 dB/div)
Rx mode RVOL () 5700 3800 1900 0 0 1900 3800 5700
Gvtx
Gvrx -400 -200 0 +200 +400
VSWT - VIDT (mV)
Fig.11 Switch-over behaviour.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL Vn(max) VRIN(max) VBB(max) Ptot PARAMETER maximum voltage on all pins; except pins VBB, RIN1 and RIN2 maximum voltage on pins RIN1 and RIN2 maximum voltage on pin VBB total power dissipation TEA1094 TEA1094A TEA1094T TEA1094AT TEA1094AM Tstg Tamb IC storage temperature operating ambient temperature Tamb = 75 C - - - - - -40 -25 1000 910 625 590 438 +125 +75 mW mW mW mW mW C C CONDITIONS MIN. VGND - 0.4 VGND - 1.2 VGND - 0.4 MAX. VBB + 0.4 VBB + 0.4 12.0 V V V UNIT
1996 Jul 15
13
Philips Semiconductors
Product specification
Hands free IC
THERMAL CHARACTERISTICS SYMBOL Rth j-a TEA1094 TEA1094A TEA1094T TEA1094AT TEA1094AM PARAMETER thermal resistance from junction to ambient in free air
TEA1094; TEA1094A
VALUE 45 50 70 75 104
UNIT K/W K/W K/W K/W K/W
CHARACTERISTICS VBB = 5 V; VGND = 0 V; f = 1 kHz; Tamb = 25 C; MUTET = LOW; PD = LOW (TEA1094A only); RL = 50 ; RVOL = 0 ; measured in test circuit of Fig.12; unless otherwise specified. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supply (VBB, GND and PD) VBB IBB VIL VIH IPD IBB(PD) supply voltage current consumption from pin VBB LOW level input voltage HIGH level input voltage input current current consumption from pin VBB in power-down condition PD = HIGH PD = HIGH 3.3 - - 3.1 12.0 4.4 V mA
POWER-DOWN INPUT PD (TEA1094A ONLY) VGND - 0.4 - 1.5 - - - 2.5 180 0.3 5 240 V A A VBB + 0.4 V
Microphone channel (MIC, GAT, MOUT, MUTET and MICGND) MICROPHONE AMPLIFIER |Zi| Gvtx Gvtxr GvtxT Gvtxf Vnotx input impedance between pins MIC and MICGND voltage gain from pin MIC to MOUT in transmit mode voltage gain adjustment with RGAT voltage gain variation with temperature referenced to 25 C voltage gain variation with frequency referenced to 1 kHz noise output voltage at pin MOUT VMIC = 1 mV (RMS); Tamb = -25 to +75 C VMIC = 1 mV (RMS); f = 300 to 3400 Hz pin MIC connected to MICGND through 200 in series with 10 F; psophometrically weighted (P53 curve) VMIC = 1 mV (RMS) 17 13 -15.5 - - - 20 15.5 - 0.3 0.3 23 18 +15.5 - - k dB dB dB dB dBmp
-100 -
1996 Jul 15
14
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
TRANSMIT MUTE INPUT MUTET VIL VIH IMUTET Gvtxm LOW level input voltage HIGH level input voltage input current voltage gain reduction with MUTET active MUTET = HIGH MUTET = HIGH VGND - 0.4 - 1.5 - - - 2.5 80 0.3 5 - V A dB VBB + 0.4 V
Loudspeaker channel (RIN1, RIN2, GAR, LSP and DLC/MUTER) LOUDSPEAKER AMPLIFIER |Zi| input impedance between pins RIN1 or RIN2 17 and GND between pins RIN1 and RIN2 Gvrx Gvrxr GvrxT Gvrxf VRIN(rms) Vnorx(rms) voltage gain in receive mode; between RIN1 and RIN2 to LSP voltage gain adjustment with RGAR voltage gain variation with temperature referenced to 25 C voltage gain variation with frequency referenced to 1 kHz maximum input voltage between RIN1 and RIN2 (RMS value) noise output voltage at pin LSP (RMS value) VRIN = 20 mV (RMS); Tamb = -25 to +75 C VRIN = 20 mV (RMS); f = 300 to 3400 Hz RGAR = 11.8 k; for 2% THD in input stage inputs RIN1 and RIN2 short-circuited through 200 in series with 10 F; psophometrically weighted (P53 curve) VRIN = 20 mV (RMS) 34 16 -18.5 - - - - 20 40 18.5 - 0.3 0.3 390 80 23 46 21 +14.5 - - - - k k dB dB dB dB mV V
CMRR Gvrxv
common mode rejection ratio voltage gain variation related to RVOL = 950
- when total attenuation does - not exceed the switching range
50 3
- -
dB dB
OUTPUT CAPABILITY VOSE(p-p) output voltage (peak-to-peak value) VRIN = 300 mV (RMS); note 1 VRIN = 150 mV (RMS); RGAR = 374 k; RL = 33 ; VBB = 9.0 V; note 2 IOM maximum output current at LSP (peak value) 3.5 - 4.5 7.5 - - V V
150
500
-
mA
1996 Jul 15
15
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
SYMBOL DYNAMIC LIMITER tatt trel THD VBB(th) tatt
PARAMETER
CONDITIONS - - - - -
MIN.
TYP. - 250 0.9 2.9 1
MAX.
UNIT
attack time when VRIN jumps from 20 mV to 20 mV + 10 dB release time when VRIN jumps from 20 mV + 10 dB to 20 mV total harmonic distortion at VRIN = 20 mV + 10 dB VBB limiter threshold attack time when VBB jumps below VBB(th) threshold voltage required on pin DLC/MUTER to obtain mute receive condition threshold current sourced by pin DLC/MUTER in mute receive condition voltage gain reduction in mute receive condition
RGAR = 374 k RGAR = 374 k RGAR = 374 k; t > tatt
5 - 5 - -
ms ms % V ms
MUTE RECEIVE VDLC(th) VGND - 0.4 - 0.2 V
IDLC(th)
VDLC = 0.2 V
-
100
-
A
Gvrxm
VDLC < 0.2 V
-
80
-
dB
Envelope and noise detectors (TSEN, TENV, RSEN, RENV, RNOI and TNOI) PREAMPLIFIERS Gv(TSEN) Gv(RSEN) voltage gain from MIC to TSEN voltage gain between RIN1 and RIN2 to RSEN ITSEN = 0.8 to 160 A 37.5 -2.5 40 0 42.5 +2.5 dB dB
LOGARITHMIC COMPRESSOR AND SENSITIVITY ADJUSTMENT Vdet(TSEN) sensitivity detection on pin TSEN; voltage change on pin TENV when doubling the current from TSEN sensitivity detection on pin RSEN; voltage change on pin RENV when doubling the current from RSEN - 18 - mV
Vdet(RSEN)
IRSEN = 0.8 to 160 A
-
18
-
mV
SIGNAL ENVELOPE DETECTORS Isource(ENV) Isink(ENV) VENV maximum current sourced from pin TENV or RENV maximum current sunk by pin TENV or RENV voltage difference between pins RENV and TENV when 10 A is sourced from both RSEN and TSEN; envelope detectors tracking; note 3 - 0.75 - 120 1 3 - 1.25 - A A mV
1996 Jul 15
16
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT A A mV
NOISE ENVELOPE DETECTORS Isource(NOI) Isink(NOI) VNOI maximum current sourced from pins TNOI or RNOI maximum current sunk by pins TNOI or RNOI voltage difference between pins RNOI and TNOI when 5 A is sourced from both RSEN and TSEN; noise detectors tracking; note 3 0.75 - - 1 120 3 1.25 - -
DIAL TONE DETECTOR VRINDT(rms) threshold level at pins RIN1 and RIN2 (RMS value) - 127 - mV
Decision logic (IDT and SWT) SIGNAL RECOGNITION VSrx(th) threshold voltage between pins RENV and RNOI to switch-over from receive to idle mode threshold voltage between pins TENV and TNOI to switch-over from transmit to idle mode VRIN < VRINDT; note 4 - 13 - mV
VStx(th)
note 4
-
13
-
mV
SWITCH-OVER Isource(SWT) Isink(SWT) Iidle(SWT) current sourced from pin SWT when switching to receive mode current sunk by pin SWT when switching to transmit mode current sourced from pin SWT in idle mode 7.5 7.5 - 10 10 0 12.5 12.5 - A A A
Voice switch (STAB and SWR) SWRA SWRA |Gv| switching range switching range adjustment voltage gain variation from transmit mode to idle mode on both channels gain tracking (Gvtx + Gvrx) during switching, referenced to idle mode with RSWR referenced to 365 k - -40 - 40 - 20 - +12 - dB dB dB
Gtr Notes
-
0.5
-
dB
1. Corresponds to 50 mW output power. 2. Corresponds to 200 mW output power. 3. Corresponds to 1 dB tracking. 4. Corresponds to 4.3 dB noise/speech recognition level. 1996 Jul 15 17
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
handbook, full pagewidth
CSWT 220 nF RIDT 2.2 M (13) 20 (16) PD (1) MOUT VBB GAT 10 (7) VVBB 19 (15) MUTET 16 (12) IDT 14 (11) SWT RSTAB 3.65 k 13 (10) STAB RSWR 365 k 12 (9) SWR CVBB 10 F
RGAT 30.1 k
CGAT
21 (17) 2 (2)
CRIN1 220 nF CRIN2 220 nF
RIN1
3 (3)
TEA1094 TEA1094A
RIN2
MIC
22 (18)
CMIC 220 nF
VMIC
18 (14)
GAR MICGND
5 (4) CGAR RGAR 66.5 k
8 (6) VRIN1
LSP GND RSEN 25 (21) RRSEN 10 k CRSEN 100 nF CRENV 470 nF CRNOI 4.7 F RENV 24 (20) RNOI 23 (19) TSEN 28 (24) RTSEN 10 k CTSEN 100 nF CTENV 470 nF CTNOI 4.7 F CDLC 470 nF TENV 27 (23) TNOI DLC/MUTER VOL 26 (22) 1 (1) 11 (8)
6 (5)
CLSP 47 F
RVOL RL 50
MGE439
The pin numbers given in parenthesis refer to the TEA1094A. (1) TEA1094A only.
Fig.12 Test circuit.
1996 Jul 15
18
book, full pagewidth
1996 Jul 15
R1 620 VCC LN MIC- 100 nF C8 MIC+ 100 nF CRIN1 QR+ 100 nF 2 (2) RIN1 CGAT C7 RGAT 30.1 k 20 (16) MOUT 21 (17) GAT
APPLICATION INFORMATION
Philips Semiconductors
Hands free IC
CSWT 220 nF RIDT 2.2 M (13) PD (1) 19 (15) MUTET 16 (12) IDT 14 (11) SWT RSTAB 3.65 k 13 (10) STAB RSWR 365 k 12 (9) SWR 10 (7) CVBB 10 F VVBB
VBB
TEA106x
line C1 100 F
3 (3)
TEA1094 TEA1094A
RIN2
MIC
22 CMIC (18) 100 nF
RMIC 2.2 k
18 (14)
GAR MICGND
5 (4) CGAR RGAR 66.5 k
19
8 (6) VEE
LSP GND RSEN 25 (21) RRSEN 10 k CRSEN 100 nF CRENV 470 nF CRNOI 4.7 F RENV 24 (20) RNOI 23 (19) TSEN 28 (24) RTSEN 10 k CTSEN 100 nF CTENV 470 nF CTNOI 4.7 F CDLC 470 nF TENV 27 (23) TNOI DLC/MUTER VOL 26 (22) 1 (1) 11 (8)
6 (5)
SLPE
CLSP 47 F
RVOL RLSP 50
R9 20
TEA1094; TEA1094A
MGE440
Product specification
The pin numbers given in parenthesis refer to the TEA1094A. (1) TEA1094A only.
Fig.13 Basic application diagram.
book, full pagewidth
1996 Jul 15
R1 620 C1 100 F tip TEA106x MICROCONTROLLER DP DTMF DTMF QR+ MIC+ VCC LN S1 MIC-
Philips Semiconductors
Hands free IC
1 k
100 F
from microcontroller CVBB 10 F VVBB
C7a 100 nF C7b C8 100 nF CRIN1 100 nF 10 F 2 (2) 2.2 k 20 (16)
(13) PD (1) MOUT TEA1094 TEA1094A
19 (15) MUTET VBB 10 (7)
MIC
22 CMIC (18) 100 nF
RMIC 2.2 k
RIN1 6 (5)
20
ring VEE interrupter The pin numbers given in parenthesis refer to the TEA1094A. (1) TEA1094A only.
18 (14) 8 (6)
MICGND
LSP
SLPE R9 20 S2
GND
CLSP LSP 50
TEA1094; TEA1094A
MGE441
Product specification
Fig.14 Application example.
Philips Semiconductors
Product specification
Hands free IC
PACKAGE OUTLINES
handbook, plastic dual in-line package; 28 leads (600 mil) DIP28: full pagewidth
TEA1094; TEA1094A
SOT117-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 28 15 MH wM (e 1)
pin 1 index E
1
14
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.020 0.014 c 0.32 0.23 0.013 0.009 D (1) 36.0 35.0 1.41 1.34 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 1.7 0.067
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT117-1 REFERENCES IEC 051G05 JEDEC MO-015AH EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-14
1996 Jul 15
21
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
DIP24: plastic dual in-line package; 24 leads (600 mil)
SOT101-1
seating plane
D
ME
A2
A
L
A1 c Z e b1 b 24 13 MH wM (e 1)
pin 1 index E
1
12
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 5.1 0.20 A1 min. 0.51 0.020 A2 max. 4.0 0.16 b 1.7 1.3 0.066 0.051 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 32.0 31.4 1.26 1.24 E (1) 14.1 13.7 0.56 0.54 e 2.54 0.10 e1 15.24 0.60 L 3.9 3.4 0.15 0.13 ME 15.80 15.24 0.62 0.60 MH 17.15 15.90 0.68 0.63 w 0.25 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT101-1 REFERENCES IEC 051G02 JEDEC MO-015AD EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-11-17 95-01-23
1996 Jul 15
22
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
SO28: plastic small outline package; 28 leads; body width 7.5 mm
SOT136-1
D
E
A X
c y HE vMA
Z 28 15
Q A2 A1 pin 1 index Lp L 1 e bp 14 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 18.1 17.7 0.71 0.69 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT136-1 REFERENCES IEC 075E06 JEDEC MS-013AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1996 Jul 15
23
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
SO24: plastic small outline package; 24 leads; body width 7.5 mm
SOT137-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 A1 pin 1 index Lp L 1 e bp 12 wM detail X (A 3) A
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 2.65 0.10 A1 0.30 0.10 A2 2.45 2.25 A3 0.25 0.01 bp 0.49 0.36 c 0.32 0.23 D (1) 15.6 15.2 0.61 0.60 E (1) 7.6 7.4 0.30 0.29 e 1.27 0.050 HE 10.65 10.00 L 1.4 Lp 1.1 0.4 Q 1.1 1.0 0.043 0.039 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z
(1)
0.9 0.4 0.035 0.016
0.012 0.096 0.004 0.089
0.019 0.013 0.014 0.009
0.419 0.043 0.055 0.394 0.016
8o 0o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT137-1 REFERENCES IEC 075E05 JEDEC MS-013AD EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-24 97-05-22
1996 Jul 15
24
Philips Semiconductors
Product specification
Hands free IC
TEA1094; TEA1094A
SSOP24: plastic shrink small outline package; 24 leads; body width 5.3 mm
SOT340-1
D
E
A X
c y HE vMA
Z 24 13
Q A2 pin 1 index A1 (A 3) Lp L 1 e bp 12 wM detail X A
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.0 A1 0.21 0.05 A2 1.80 1.65 A3 0.25 bp 0.38 0.25 c 0.20 0.09 D (1) 8.4 8.0 E (1) 5.4 5.2 e 0.65 HE 7.9 7.6 L 1.25 Lp 1.03 0.63 Q 0.9 0.7 v 0.2 w 0.13 y 0.1 Z (1) 0.8 0.4 8 0o
o
Note 1. Plastic or metal protrusions of 0.20 mm maximum per side are not included. OUTLINE VERSION SOT340-1 REFERENCES IEC JEDEC MO-150AG EIAJ EUROPEAN PROJECTION
ISSUE DATE 93-09-08 95-02-04
1996 Jul 15
25
Philips Semiconductors
Product specification
Hands free IC
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO and SSOP REFLOW SOLDERING Reflow soldering techniques are suitable for all SO and SSOP packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating
TEA1094; TEA1094A
method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering is not recommended for SSOP packages. This is because of the likelihood of solder bridging due to closely-spaced leads and the possibility of incomplete solder penetration in multi-lead devices. If wave soldering cannot be avoided, the following conditions must be observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow and must incorporate solder thieves at the downstream end. Even with these conditions, only consider wave soldering SSOP packages that have a body width of 4.4 mm, that is SSOP16 (SOT369-1) or SSOP20 (SOT266-1). During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1996 Jul 15
26
Philips Semiconductors
Product specification
Hands free IC
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TEA1094; TEA1094A
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1996 Jul 15
27
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. +61 2 9805 4455, Fax. +61 2 9805 4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS, Tel. +1 800 234 7381, Fax. +1 708 296 8556 China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, HONG KONG, Tel. +852 2319 7888, Fax. +852 2319 7700 Colombia: see South America Czech Republic: see Austria Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. +45 32 88 2636, Fax. +45 31 57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 615 800, Fax. +358 615 80920 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427 Germany: Hammerbrookstrae 69, D-20097 HAMBURG, Tel. +49 40 23 52 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. +30 1 4894 339/911, Fax. +30 1 4814 240 Hungary: see Austria India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd. Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722 Indonesia: see Singapore Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 648 1007 Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108, Tel. +81 3 3740 5130, Fax. +81 3 3740 5077 Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. +82 2 709 1412, Fax. +82 2 709 1415 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. +60 3 750 5214, Fax. +60 3 757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905, Tel. +1 800 234 7381, Fax. +1 708 296 8556 Middle East: see Italy Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 83749, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. +64 9 849 4160, Fax. +64 9 849 7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Philippines: Philips Semiconductors Philippines Inc., 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Romania: see Italy Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 926 5361, Fax. +7 095 564 8323 Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. +65 350 2538, Fax. +65 251 6500 Slovakia: see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America: Rua do Rocio 220, 5th floor, Suite 51, 04552-903 Sao Paulo, SAO PAULO - SP, Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 632 2000, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1, P.O. Box 22978, TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444 Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260, Tel. +66 2 745 4090, Fax. +66 2 398 0793 Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 2A Akademika Koroleva str., Office 165, 252148 KIEV, Tel. +380 44 476 0297/1642, Fax. +380 44 476 6991 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. +1 800 234 7381, Fax. +1 708 296 8556 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 825 344, Fax.+381 11 635 777
For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825 (c) Philips Electronics N.V. 1996
Internet: http://www.semiconductors.philips.com/ps/ (1) TEA1094_3 June 26, 1996 11:51 am SCA50
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands
417021/1200/03/pp28 Date of release: 1996 Jul 15 Document order number: 9397 750 00926

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